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按一下以編輯母片標(biāo)題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,*,印刷電路板流程介紹,教育,訓(xùn),訓(xùn) 練,教,教材,流程,圖,圖 PCB Mfg.FLOWCHART,顧客 (,CUSTOMER),工程製前(,FRONT-END DEP.),裁板(,LAMINATE SHEAR),內(nèi) 層乾膜(,INNERLAYER IMAGE),預(yù) 疊板及疊板(,LAY-UP),通孔電鍍(,P.T.H.),液態(tài) 防焊(,LIQUID S/M ),外觀檢查(,VISUAL INSPECTION),成型(,FINAL SHAPING),業(yè) 務(wù)(,SALES DEPARTMENT),生產(chǎn) 管理(,P&M CONTROL),蝕銅(,I/L ETCHING),鑽孔 (,PTH DRILLING),壓合(,LAMINATION),外層乾膜(,OUTERLAYERIMAGE),二次銅及錫鉛電鍍(,PATTERN PLATING),蝕銅(,O/L ETCHING),檢查(,INSPECTION),噴錫(,HOT AIR LEVELING),電測(,ELECTRICAL TEST ),出貨前檢查(,O Q C ),包裝出貨(,PACKING&SHIPPING ),曝光 (,EXPOSURE),壓膜(,LAMINATION),前處理(,PRELIMINARY TREATMENT,),顯影(,DEVELOPIG),蝕銅(,ETCHING,),去膜 (,STRIPPING),黑化處理(,BLACK OXIDE),烘烤(,BAKING,),預(yù) 疊板及疊板(,LAY-UP),壓合(,LAMINATION),後處理(,POSTTREATMENT),曝光(,EXPOSURE),壓膜(,LAMINATION),二次銅電鍍(,PATTERNPLATING),錫鉛電鍍(,T/L PLATING),去膜(,STRIPPING),蝕銅(,ETCHING),剝錫鉛(,T/L STRIPPING),塗佈印刷,(S/M COATING),預(yù) 乾燥,(PRE-CURE),曝光(,EXPOSURE),顯影(,DEVELOPING),後烘烤(,POST CURE),多層板內(nèi)層流程,(,INNER LAYER PRODUCT),MLB,全板電鍍(,PANEL PLATING),銅面防氧化處理(,O S P(Entek Cu 106A),外層製作(,OUTER-LAYER),TENTING,PROCESS,鍍金手指(,G/F PLATING),鍍化學(xué) 鎳金(,E-less Ni/Au),選擇性鍍鎳鍍金(,SELECTIVE GOLD),印文字(,SCREEN LEGEND ),網(wǎng) 版製作(,STENCIL,),圖面(,DRAWING),工作底片(,WORKING A/W),製作規(guī) 範(fàn)(,RUN CARD),程式帶(,PROGRAM),鑽孔,成型機(jī)(,D.N.C.),底片,(,MASTER A/W),磁片,磁帶,(,DISK,M/T),藍(lán) 圖,(,DRAWING),資料傳送,(,MODEM,FTP),A O I 檢查(,AOI INSPECTION),除膠渣(,DESMER),通孔電鍍,(E-LESS CU),DOUBLE,SIDE,前處理(,PRELIMINARY TREATMENT,),前處理(,PRELIMINARY TREATMENT,),前處理(,PRELIMINARY TREATMENT,),ForO.S.P.,印刷,電,電路,板,板流,程,程介,紹,紹,P2,(1)前,製,製程,治,治工,具,具製,作,作流,程,程,鑽孔,成型機(jī),D.N.C.,BROAD,BROAD,顧客,CUSTOMER,裁板,LAMINATE SHEAR,業(yè) 務(wù),SALES DEP.,生產(chǎn)管理,P&M CONTROL,MASTER A/W,底片,DISK,M/T,磁片磁帶,藍(lán) 圖,DRAWING,資料傳送,MODEM,FTP,網(wǎng)版製作,STENCIL,DRAWING,圖面,RUN CARD,製作規(guī)範(fàn),PROGRAM,程式帶,工程製前,FRONT-END DEP.,工作底片,WORKING A/W,印刷,電,電路,板,板流,程,程介,紹,紹,P3,(2)多,層,層板,內(nèi),內(nèi) 層,製,製作,流,流程,BROAD,BROAD,曝光,EXPOSURE,壓膜,LAMINATION,前處理,PRELIMINARY,TREATMENT,去膜,STRIPPING,蝕銅,ETCHING,顯影,DEVELOPING,黑化處理,BLACK OXIDE,烘烤,BAKING,LAY-UP,預(yù)疊板及疊板,後處理,POST TREATMENT,壓合,LAMINATION,內(nèi)層乾膜,INNERLAYER IMAGE,預(yù)疊板及疊板,LAY-UP,蝕銅,I/L ETCHING,鑽孔,DRILLING,壓合,LAMINATION,多層板內(nèi)層流程,INNER LAYER PRODUCT,MLB,AO I,檢查,AOI INSPECTION,裁板,LAMINATE SHEAR,DOUBLE,SIDE,印刷,電,電路,板,板流,程,程介,紹,紹,P4,(3)外,層,層製,作,作流,程,程,BROAD,BROAD,通孔電鍍,P.T.H.,鑽孔,DRILLING,外層乾膜,OUTERLAYER IMAGE,二次銅及錫鉛電鍍,PATTERN PLATING,檢查,INSPECTION,前處理,PRELIMINARY,TREATMENT,二次銅電鍍,PATTERN PLATING,蝕銅,ETCHING,全板電鍍,PANEL PLATING,外層製作,OUTER-LAYER,O/L ETCHING,蝕銅,TENTING,PROCESS,DESMER,除膠渣,E-LESS CU,通孔電鍍,前處理,PRELIMINARY,TREATMENT,剝錫鉛,T/L STRIPPING,去膜,STRIPPING,壓膜,LAMINATION,錫鉛電鍍,T/L PLATING,曝光,EXPOSURE,印刷,電,電路,板,板流,程,程介,紹,紹,P5,(4)外,觀,觀及,成,成型,製,製作,流,流程,BROAD,BROAD,液態(tài)防焊,LIQUID S/M,外觀檢查,VISUAL INSPECTION,成型,FINAL SHAPING,檢查,INSPECTION,電測,ELECTRICAL TEST,出貨前檢查,O Q C,包裝出貨,PACKING&SHIPPING,塗佈印刷,S/M COATING,前處理,PRELIMINARY,TREATMENT,曝光,EXPOSURE,DEVELOPING,顯影,POST CURE,後烘烤,預(yù)乾燥,PRE-CURE,噴錫,HOT AIR LEVELING,銅面防氧化處理,O S P(Entek Cu 106A),HOT AIR LEVELING,G/F PLATING,鍍金手指,鍍化學(xué)鎳金,E-less Ni/Au,For O.S.P.,印文字,SCREEN LEGEND,選擇性鍍鎳鍍金,SELECTIVE GOLD,印刷,電,電路,板,板流,程,程介,紹,紹,P6,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,1.,內(nèi)層,THINCORE,2.,內(nèi)層線路,製,製作(壓,膜,膜),印刷,電,電路,板,板流,程,程介,紹,紹,P7,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,4.內(nèi),層,層線路製,作,作(顯影),3.內(nèi),層,層線路製,作,作(曝光),印刷,電,電路,板,板流,程,程介,紹,紹,P8,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,5.內(nèi),層,層線路製,作,作(蝕刻),6.內(nèi),層,層線路製,作,作(去膜),印刷,電,電路,板,板流,程,程介,紹,紹,P9,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,7.疊,板,板,8.壓,合,合,LAYER 2,LAYER 3,LAYER 4,LAYER 5,LAYER 1,LAYER 6,印刷,電,電路,板,板流,程,程介,紹,紹,P10,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,9.鑽,孔,孔,10.,鍍,鍍通孔及,一,一次銅,印刷,電,電路,板,板流,程,程介,紹,紹,P11,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,11.,外,外層線路,壓,壓膜,12.,外,外層線路,曝,曝光,印刷,電,電路,板,板流,程,程介,紹,紹,P12,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,13.,外,外層線路,製,製作(顯,影,影),14.,鍍,鍍二次銅,及,及錫鉛,印刷,電,電路,板,板流,程,程介,紹,紹,P13,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,15.,去,去乾膜,16.,蝕,蝕銅(鹼,性,性蝕刻液),印刷,電,電路,板,板流,程,程介,紹,紹,P14,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,17.,剝,剝錫鉛,18.,防,防焊(綠,漆,漆)製作,印刷,電,電路,板,板流,程,程介,紹,紹,P15,BROAD,BROAD,典型多層,板,板製作流,程,程-MLB,15.,浸,浸金(噴,錫,錫),製,製作,印刷,電,電路,板,板流,程,程介,紹,紹,P16,BROAD,BROAD,乾膜,製,製,作,作,流,流程,基板,壓膜,壓膜後,曝光,顯影,蝕銅,去膜,印刷,電,電路,板,板流,程,程介,紹,紹,P17,BROAD,BROAD,典型之多,層,層板疊板,及,及壓合結(jié),構(gòu),構(gòu),.,.,.,COPPER FOIL 0.5 OZ,Thin Core,FR-4,prepreg,COMP,S0LD.,prepreg,Thin Core,FR-4,prepreg,COPPER FOIL 0.5 OZ,疊合用之鋼板,疊合用之鋼板,10-12層疊合,壓合機(jī)之熱板,壓合機(jī)之熱板,COPPER FOIL 0.5 OZ,Thin Core,FR-4,prepreg,COMP,S0LD.,prepreg,Thin Core,FR-4,prepreg,COPPER FOIL 0.5 OZ,疊合用之鋼板,疊合用之鋼板,印刷,電,電路,板,板流,程,程介,紹,紹,P18,BROAD,BROAD,1.下料,裁,裁板(,Panel Size),COPPER FOIL,Epoxy Glass,Photo Resist,2.內(nèi)層,板,板壓乾膜(光阻劑),印刷,電,電路,板,板流,程,程介,紹,紹,P19,BROAD,BROAD,3.曝光,4.曝光,後,後,Artwork,(底片),Artwork,(底片),Photo Resist,光源,印刷,電,電路,板,板流,程,程介,紹,紹,P20,BROAD,BROAD,5.內(nèi)層,板,板顯影,Photo Resist,6.酸性,蝕,蝕刻(,Power/Ground,或,或Signal),Photo Resist,印刷,電,電路,板,板流,程,程介,紹,紹,P21,BROAD,BROAD,8.黑化(Oxide Coating),7.去乾,膜,膜(Strip Resist),印刷,電,電路,板,板流,程,程介,紹,紹,P22,BROAD,BROAD,9.疊板,Layer 1,Layer 2。

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